The May 24, 2018 - - 2017 (third batch) application leader base has completed the bidding, and the state Advisory new energy research center (EnergyTrend) analysis of the bidding results found that the single crystal product still occupies an absolute advantage, and the double-sided power generation technology is more than 50%. The expected product content will lead to the upgrading of industrial technology and market demand.

IC design service factory operation is strong, including creativity, wisdom and crystal core, etc., all optimistic about this quarter's revenue will gradually return to temperature.

With the maturity of communication technology, the Internet related applications of the Internet of things are carrying on the silent revolution to human life. It is not a dream to connect all things. At present, the chip supply of the Internet of things is based on the international IDM (integrated component manufacturing) factory. The IC design industry in Taiwan has developed an indirect connection between the chip and the Internet of things. Sheng Qun, gathering, silicon force -KY, new Tang, Kang Kang, Sheng Ke, song Han and so on all have ink, and the proportion of IOT application revenue will increase year by year in the future.

In order to improve the performance of mid-range models and accelerate the popularization of artificial intelligence (AI) applications, Armor International has announced the launch of a new Mali Multimedia IP Suite that...

NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.

Rogers is pleased to introduce the CLTE-MW laminate. This is a ceramic-filled PTFE glass fiber reinforced composite circuit material designed for circuit design engineers to optimize costs and improve performance and development. This unique circuit material system is well suited for applications where the thickness is limited or controlled due to physical or electrical characteristics.

Today announced the 2.5D package solution, demonstrating its capabilities for the high-performance 14nm FinFET FX-14ASIC integrated circuit design system.

ADLINK is committed to promoting cross-industry data decision-making applications, as the world's leading provider of edge computing solutions, today announced the new media cloud server MCS-2080, a dedicated high-density platform, in 2U space can support Up to 16 Intel Xeon E3-1585 v5 processors.

Vishay Intertechnology, Inc. today announced the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications - the VitramonVJ HIFREQ HT series with operating temperature range of +200 ° C

GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.