Powerchip Group4Day heldComputing in MemoryIntegrated Technology Platform Press Conference，And published the world's first revolutionary architectureAIM。Founder Huang Chongren said，AIMIs promotion20Double the computing p...

Highly integrated power management、Charging、AC/DC the power conversion、Wi-FiAnd Bluetooth low energy technology vendorsDialogSemiconductor company(German stock exchange trading code：DLG)Announced today，It is the smallest...

According to Jiwei. com, a ghost incident broke out in Basf, a global maximization industry company. Huang Senior Manager and Lin retired factory director were suspected of colluding with their competitors. At the cost o...

IBM signed an agreement with Samsung Wafer Factory to use Samsung's 7-nanometer EUVL process to manufacture its next-generation processors, which will be used for IBM Power Systems, IBM Z and Linux ONE Systems. IBM's for...

Following the release of the world's first 5G mobile phone chip "Qiaolong 855" by Qualcomm, a global chip manufacturer, on July 7th, Taiwan's Unified Development Section officially released its first 5G multi-mode integr...

According to a survey conducted by Taiwan research institutes, 5G high frequency communication chip packaging is expected to develop towards AiP technology and fan-out packaging technology in the future. It is expected t...

According to the latest research report released by the European Union Telegraph Finance Report after the report, the pressure on the correction of the operation fundamentals of the United Telegraph is increasing, and it is expected that it will be in the fourth quarter of this year (2018) with the expectation that the performance outlook of the fourth quarter of the United Telegraph Financial Report is less than expected and that the supply will exceed demand due to the opening of new capacity in the market next year. In the first quarter of Ming (2019), the company was facing an operating loss and lowered its forecast earnings per share from 2018 to 2020 to maintain its "sell" rating. The target price was slightly revised down to 11.5 yuan.

Leti, A Research Institute of ST and CEA Tech, announced a collaborative effort to develop silicon-based GaN power switching module manufacturing technology. The silicon-based GaN power technology will enable Italian Semiconductors to meet high-performance, high-power applications, including hybrid and electric vehicle chargers, wireless charging and servers.

In the provisional meeting of shareholders yesterday (20), some minority shareholders suggested that the company deal with cash reduction or implement Treasury shares, in order to enhance shareholders'rights and interests. Hong Jiacong, chairman of the joint venture, said he would consider the proposals of the minority shareholders and report to the board of directors.

Korean industry minister Bai Yunkui (Paik Un-gyu) on Monday (30) visited the main semiconductor production line of 005930-KR and 000660-KR, and vowed to invest 1 trillion and 500 billion won ($1 billion 340 million) in the next 10 years to strengthen the competitiveness of South Korean semiconductors.