-
Nxp Released The World's First Single-chip, Scalable Security V2x PlatformSource:NXP Semiconductors Release Date:2017/9/19 Click On:5731
NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.
Details -
Western Digital (wd) Breakthrough Technology To Limit The Introduction Of High-capacity Microsd Memory CardSource:Western Digital (WD) Release Date:2017/9/19 Click On:4746
SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.
Details -
Kla-tencor Introduces Five Development Control Systems For The Manufacture Of Ics Below 7 NanometersSource:KLA-Tencor Release Date:2017/9/18 Click On:4571
KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.
Details -
Flirsystems Launched The Automation Mio Series, Help Enterprises To Achieve Remote SupervisionSource:FLIRSystems,Inc. Release Date:2017/9/6 Click On:3966
Recently, FLIR, a global leader in infrared thermal imaging, has introduced a new intelligent I / O solution specifically designed for FLIR infrared cameras to enable FLIR customers to integrate FLIR AX8, A310 and FCR thermal imagers with MIO to create a complete robust system for condition monitoring, early fire detection and process monitoring.
Details -
Te Connectivity Introduces The Strada Whisper Cable AssemblySource:TE Connectivity Release Date:2017/8/25 Click On:3374
TE Connectivity (TE), a global leader in connectivity and sensor technology, today announced the STRADA Whisper Cable Assemblies product line. Without the use of printed circuit board (PCB) materials, the STRADA Whisper cable connector supports high-speed data transfer for superior performance and greater flexibility.
Details -
Accelstor Released The Latest High Availability And Can Be Vertically Extended Full Flash Memory Storage ArraySource:AccelStor Release Date:2017/8/24 Click On:3711
AccelStor Announces New High Availability and Expandable Full Flash Memory Storage Array The NeoSapphire H710 provides flexible, flexible storage configurations for mission critical applications for enterprise users Capacity can be expanded from 27TB to 221TB.
Details -
Meganson / Mellanox / Celestica Co-developed The Nvme-of ArchitectureSource:New EC Release Date:2017/8/22 Click On:4290
MEGAN announced today that Mellanox, a provider of high-performance end-to-end intelligent interconnection solutions for data center servers and storage systems, and Celestica, a global leader in end-to-end product lifecycle solutions, Of the unique reference architecture of the Fabric (NVMe-oF) application as part of the USSRM Accelerated Ecosystem Project.
Details -
Allegro Microsystems Introduces A User-configurable Dual Fault FeatureSource:Allegro Release Date:2017/8/18 Click On:3630
Allegro MicroSystems, LLC announced a new high-precision Hall effect current sensor IC ACS720 with a variety of programmable fault levels for industrial and consumer applications, especially for motor control and power inverter applications.
Details -
Nvidia Virtual Data Center Workstation Software Helps Tesla Gpu ServersSource:NVIDIA Release Date:2017/8/18 Click On:3804
NVIDIA announced a new virtualization software feature that transforms the NVIDIA Tesla GPU Acceleration Server into a powerful workstation and provides the IT department with the resources it needs to meet the needs of an enterprise virtual office environment.
Details -
Iphone 8 Pull Goods To Start Nor Flash Exclusive Supplier Winbond Power To Next YearSource:Chinatimes Release Date:2017/8/17 Click On:3672
Memory plant Winbond successfully into the Apple iPhone 8 supply chain. According to Apple supply chain industry, said Winbond exclusive supply of NOR Flash products, and Samsung AMOLED panel together into a mobile phone panel module, in August began heavy volume shipments, and applied in the Apple iPhone 8 products, on behalf of China Bang electric operation will be expected to flourish to the first half of next year.
Details
Popular Industry Information
- 1 5G Business Is Expected To Continue To Drive South Korea Exports
- 2 Amd And Nvidia Fail By Quantity Pricing Strategy Gpu Price Rise Is Still Hard To Stop
- 3 New All-optical Diode Can Be Used In Miniature Optical Circuits
- 4 Resistance Rises Again: Tdk Capacitor Rises 3-4 Times
- 5 Stmicroelectronics Announced The Initial Revenue In The Fourth Quarter Of 2020
- 6 Global Crystal: Acquisition Of The World's Lowest Price Drop 15% Of The Acquisition Time Is Extended To February 10
- 7 Toshiba's $18 Billion Chip Sale Could Not Be Completed On Time: Or Consider Ipo
- 8 Zikuo Shares Combined Acquisition And Holdings Purple Transport Cloud Perfect Cloud Computing Industry Chain
- 9 Intel Needs To Expand Wafer To Strengthen Dram Advantage If It Wants To Get Back To First Place
- 10 This Year's First Quarter Of The Station, 5 Nanometers, Or Still Maintains High-End
- Hot Keywords:
- All Intel Samsung AMD TSMC chip Qualcomm semiconductor Semiconductor 5G Apple MediaTek NVIDIA AI high pass IC Google AI chip The Department of United hair DRAM High pass CPU Foxconn MLCC Taiwan Q2 HUAWEI Technology electronics Huawei Chip Microelectronics Semiconductor ICs Mobile phone Microsoft revenue apple Toshiba ARM 7 nanometers ASIC Samsung Electronics semiconductors microelectronics 7Nm products SEMI TM Hon Hai Qorvo NXP
