Industrial Research Institute of ITRI (IEK) cited market research institutions survey report pointed out that last year the global DRAM prices soar, the output value increased by about 77%, reaching 72.5 billion US dollars, the average sales price rose 55%; this year, the pre- Estimated or in short supply, although the strength is not as good as last year's growth, but the major suppliers are still increasing their production under control. The average selling price is expected to rise more than 32% this year, and its annual output value will increase by about 23% to nearly 90 billion U.S. dollars , A new high over the years.

January 31, although the memory chip prices have dropped than in the past, but Samsung's future mobile phones and other mobile products is still strong demand. Earnings report, Samsung Electronics fourth quarter operating profit up 64% year-on-year to 15.15 trillion won (about 141.38 billion US dollars), memory contribution to profits accounted for about 2/3 of 10.2 trillion won, compared with the same period in 2016 Grow more than twice.

The European Commission said Qualcomm's proposal for a patent license has eliminated concerns that the deal could affect chip sales. Qualcomm promised not to acquire some NXP patents related to near field communications. Qualcomm will also maintain the existing license terms for NXP's Mifare technology used on the London subway card system for a period of eight years and will ensure that the NXP chip will interoperate with other chips.

According to the latest report of Counterpoint's third quarter 2017 market monitoring project, the strong performance of Korean brands Samsung and Chinese brands in the third quarter of 2017 drove up 13% of the global mobile phone overall profit. The cumulative profits of domestic brands for the first time in just over a quarter of more than 1.5 billion US dollars.

The era of "all things connected" is gradually approaching. Since 2017 NB-IoT (Narrowband Internet of Things) ushered in large-scale commercial applications in China. All major telecom operators and network equipment providers have accelerated the pace of industrial distribution in order to boost the development of the domestic Internet of Things industry. Experts said that the Internet of Things is coming. However, the development of the Internet of Things often faces the phenomenon of fragmentation of technologies and applications. To overcome this difficulty, it is necessary to unite the efforts of all sectors in the industry to increase openness and cooperation and build an ecological environment where Dalian can connect and cooperate with each other.

Yesterday, Baoneng New Energy Vehicle Co., Ltd., Guangdong Cores Chip Project and IC Industrial Innovation Park of Guangzhou Development Zone and the Southern Hospital of Knowledge City started construction in Zhongxin Knowledge City. Guangzhou Municipal Committee Ren Xuefeng, deputy secretary of municipal Party committee, mayor Wen Guohui, municipal CPPCC Chairman Liu Yuelun respectively with the Group Chairman Yao Zhenhua, Guangzhou Jin Yu Industrial Investment Group Chairman Li Yongxi, Guangzhou Yuecun Semiconductor Technology Co., Chip and the first batch of contracted 15 project leaders (including 9 chip design projects, 1 design and test service platform, 3 package test items, 1 material project, 1 industrial fund) who settled in IC Development Park of Guangzhou Development Zone Project), Southern Medical University Party Secretary Chen Minsheng, Nanfang Hospital Dean Li Wenyuan, Southern Hospital Party Secretary Zhu Hong discussion. City leaders Chen Zhiying, Zhou Yawei, Pan Jianguo, dawn to participate.

Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.

This week, according to the Yonhap news agency, Samsung Electronics announced that it has started using the second-generation 10nm process to produce 8Gb DDR4 particles, another iteration of technology after two years of the first-generation 10nm process.

Tektronix, the world's leading supplier of measurement solutions, today introduced the new DPO7OE1, a calibrated optical probe and analysis software for use with real-time oscilloscopes, and is an optical reference for compatibility with 28-GBaud PAM4 applications Receiver (ORR), and can support IEEE / OIF-CEI standard specific measurement. The new solution complements Tektronix's sampling oscilloscope optical PAM4 analysis tool, providing the design team with an effective test solution for all stages of the optical transmitter workflow.

SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.