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Kla-tencor Introduces Five Development Control Systems For The Manufacture Of Ics Below 7 NanometersSource:KLA-Tencor Release Date:2017/9/18 Click On:4571
KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.
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Ni Introduces New Pxi Remote Control And Bus Expansion Modules For High Throughput ApplicationsSource:National Instruments Release Date:2017/9/6 Click On:3632
NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.
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Hua Hong Semiconductor Pushing 95 Nm Envm Process Platform To Win The 8-bit Mcu MarketSource:Hua Hong Semiconductor Release Date:2017/9/4 Click On:4442
("Hua Hong Semiconductor" or "Company", together with its subsidiaries, collectively the "Group", stock code: 1347.HK) announced today that the Company's announcement of the Company's Microcontroller Unit (MCU) market, the latest launch of 95 nm single insulated gate non-volatile embedded memory (95 nm 5V SG eNVM) process platform. In ensuring the stability of the product at the same time, 95 nm 5V SG eVM process platform for its low power consumption, low cost advantage, widely favored by customers. The platform has been successfully mass production, product performance.
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Lem Electronics Helps New Energy Vehicles With Charging Technologies For New Ecology, New FutureSource:LEM Electronics Release Date:2017/9/4 Click On:4385
Power market leader in the field of sensors and high-quality power measurement solutions provider LME Electronics recently debut in Shanghai opened the ninth session of the Shanghai International Charging Station (Pile) Technology and Equipment Exhibition, the exhibition site to show its low-power charger , High-power charger and battery detection field of leading-edge technology, with nearly 200 customers to exchange demand and details Lyme Electronics latest solutions, with action to promote the charging infrastructure.
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Rogers Launches Clte-mw (tm) Laminates For 5g And Other Millimeter-wave ApplicationsSource:Rogers Release Date:2017/8/28 Click On:3529
Rogers is pleased to introduce the CLTE-MW laminate. This is a ceramic-filled PTFE glass fiber reinforced composite circuit material designed for circuit design engineers to optimize costs and improve performance and development. This unique circuit material system is well suited for applications where the thickness is limited or controlled due to physical or electrical characteristics.
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Picoscope Deepmeasure Can Measure Tens Of Millions Of Key Waveform Parameters Collected Each TimeSource:Pico Technology Release Date:2017/8/28 Click On:3392
Pico Technology, the market leader in PC oscilloscopes and data loggers, today introduced the DeepMeasure analysis tool. As a standard configuration for the PicoScope 3000, 4000, 5000 and 6000 series oscilloscopes, DeepMeasure provides automatic measurement of waveform parameters up to tens of millions of continuous waveform cycles. The results can be sorted easily, analyzed and associated with the waveform display.
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Accelstor Released The Latest High Availability And Can Be Vertically Extended Full Flash Memory Storage ArraySource:AccelStor Release Date:2017/8/24 Click On:3711
AccelStor Announces New High Availability and Expandable Full Flash Memory Storage Array The NeoSapphire H710 provides flexible, flexible storage configurations for mission critical applications for enterprise users Capacity can be expanded from 27TB to 221TB.
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Kla-tencor Announces The Launch Of The Flashscan ? Product Line For Optical And Euv Blank EnclosuresSource:KLA-Tencor Release Date:2017/8/22 Click On:3793
KLA-Tencor announces the launch of the new FlashScan ™ blank mask * detection product line. Since the launch of the first inspection system in 1978, KLA-Tencor has been a major supplier of pattern mask inspection, and the new FlashScan product line has announced that the company has entered a dedicated blank mask inspection market.
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Meganson / Mellanox / Celestica Co-developed The Nvme-of ArchitectureSource:New EC Release Date:2017/8/22 Click On:4290
MEGAN announced today that Mellanox, a provider of high-performance end-to-end intelligent interconnection solutions for data center servers and storage systems, and Celestica, a global leader in end-to-end product lifecycle solutions, Of the unique reference architecture of the Fabric (NVMe-oF) application as part of the USSRM Accelerated Ecosystem Project.
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Allegro Microsystems Introduces A User-configurable Dual Fault FeatureSource:Allegro Release Date:2017/8/18 Click On:3630
Allegro MicroSystems, LLC announced a new high-precision Hall effect current sensor IC ACS720 with a variety of programmable fault levels for industrial and consumer applications, especially for motor control and power inverter applications.
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